照明用LED封装：设计、制造和测试（英文版）
出版时间：2011年版
内容简介
刘胜、罗小兵编著的《照明用LED封装——设计、制造与测试》侧重于大功率LED封装与应用，即设计、制造与测试。包括基础研究、建模仿真、设计方法、工程案例等。特别体现为在LED封装设计和制造中尤为重要的内容：可靠性工程学，包括可靠性的基础、测试、快速评估等；光学设计方法，包括反光器、自由曲面透镜、扩散板等，以及LED路灯、车灯、背光等典型应用产品的光学设计；系统散热分析，新型热管理方法，散热翅片优化设计等；封装模块的热管理及低热阻封装结构；LED测试与标准。同时附以最新的中国LED路灯标准，供读者参考。 《照明用LED封装——设计、制造与测试》可供对LED封装和灯具设计、加工和测试感兴趣的研究者、工程师和学生使用，也可供外延生长和芯片设计人员做耦合设计参考。
目录
Foreword by Magnus George Craford Foreword by C.P.Wong Foreword by B.J.Lee Preface Acknowledgments About the Authors 1 Introduction 1.1 Historical Evolution of Lighting Technology 1.2 Development of LEDs 1.3 Basic Physics of LEDs 1.3.1 Materials 1.3.2 Electrical and Optical Properties 1.3.3 Mechanical and Thermal Properties 1.4 Industrial Chain of LED 1.4.1 LED Upstream Industry 1.4.2 LED Midstream Industry 1.4.3 LED Downstream Industry 1.5 Summary References 2 Fundamentals and Development Trends of High Power LED Packaging 2.1 Brief Introduction to Electronic Packaging 2.1.1 About Electronic Packaging and Its Evolution 2.1.2 Wafer Level Packaging, More than Moore, and SiP 2.2 LED Chips 2.2.1 Current Spreading Efficiency 2.2.2 Internal Quantum Efficiency 2.2.3 High Light Extraction Efficiency 2.3 Types and Functions of LED Packaging 2.3.1 Low Power LED Packaging 2.3.2 High Power LED Packaging 2.4 Key Factors and System Design of High Power LED Packaging 2.5 Development Trends and Roadmap 2.5.1 Technology Needs 2.5.2 Packaging Types 2.6 Summary References 3 Optical Design of High Power LED Packaging Module 3.1 Properties of LED Light 3.1.1 Light Frequency and Wavelength 3.1.2 Spectral Distribution 3.1.3 Flux of Light 3.1.4 Lumen Efficiency 3.1.5 Luminous Intensity, Illuminance and Luminance 3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering Index 3.1.7 White Light LED 3.2 Key Components and Packaging Processes for Optical Design 3.2.1 Chip Types and Bonding Process 3.2.2 Phosphor Materials and Phosphor Coating Processes 3.2.3 Lens and Molding Process 3.3 Light Extraction 3.4 Optical Modeling and Simulation 3.4.1 Chip Modeling 3.4.2 Phosphor Modeling 3.5 Phosphor for White LED Packaging 3.5.1 Phosphor Location for White LED Packaging 3.5.2 Phosphor Thickness and Concentration for White LED Packaging 3.5.3 Phosphor for Spatial Color Distribution 3.6 Collaborative Design 3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages 3.6.2 Application Specific LED Packages 3.7 Summary References 4 Thermal Management of High Power LED Packaging Module 4.1 Basic Concepts of Heat Transfer 4.1.1 Conduction Heat Transfer 4.1.2 Convection Heat Transfer 4.1.3 Thermal Radiation 4.1.4 Thermal Resistance 4.2 Thermal Resistance Analysis of Typical LED Packaging 4.3 Various LED Packages for Decreasing Thermal Resistance 4.3.1 Development of LED Packaging 4.3.2 Thermal Resistance Decrease for LED Packaging 4.3.3 SiP/COB LED Chip Packaging Process 4.4 Summary References 5 Reliability Engineering of High Power LED Packaging 5.1 Concept of Design for Reliability (DfR) and Reliability Engineering 5.1.1 Fundamentals of Reliability 5.1.2 Life Distribution 5.1.3 Accelerated Models 5.1.4 Applied Mechanics 5.2 High Power LED Packaging Reliability Test 5.2.1 Traditional Testing Standards, Methods, and Evaluation 5.2.2 Methods for Failure Mechanism Analysis 5.2.3 Failure Mechanisms Analysis 5.3 Rapid Reliability Evaluation 5.3.1 Material Property Database 5.3.2 Numerical Modeling and Simulation 5.4 Summary References 6 Design of LED Packaging Applications 6.1 Optical Design 6.1.1 Introduction of Light Control 6.1.2 Reflectors 6.1.3 Lenses 6.1.4 Diffuser 6.1.5 Color Design and Control in LED Applications 6.2 Thermal Management 6.2.1 Analysis of System Thermal Resistance 6.2.2 Types of Heat Dissipation to Environment 6.2.3 Design and Optimization of Fin Heat Sink 6.2.4 Design Examples of Thermal Management of Typical LED Lighting Systems 6.3 Drive Circuit and Intelligent Control Design 6.3.1 Typical LED Wireless Intelligent Control System 6.3.2 Working Principles of Wireless Intelligent Control System 6.4 Summary References 7 LED Measurement and Standards 7.1 Review of Measurement for LED Light Source 7.2 Luminous Flux and Radiant Flux 7.3 Measurement for Luminous Intensity 7.4 LED Chromaticity Coordinates 7.5 Dominant Wavelength Determination Algorithm 7.5.1 Curve Fitting Method 7.6 LED Color Purity 7.7 Color Temperature and Correlated Color Temperature of Light Source 7.8 Automatic Sorting for LEDs 7.9 Measurement for LED Road Lights 7.9.1 Electrical Characteristics 7.9.2 Color Characteristics 7.9.3 Light Distribution Characteristics 7.9.4 Dynamic Characteristics 7.9.5 Test of Reliability 7.10 Summary References Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance Index
