集成电路封装材料的表征（英文）
作者：（美）布伦德尔，（美）埃文斯，（美）摩尔 主编
出版时间：2014年版
丛编项： 材料表征原版系列丛书
内容简介
《集成电路封装材料的表征（英文）》的主要内容包括： Foreword；Preface to the Reissue of the Materials Characterization Series xiii；Preface to Series xiv；Preface to the Reissue of Integrated Circuit Packaging Materials xv；Preface xvi；Contributors xix等。
目录
Foreword xi
Preface to the Reissue of the Materials Characterization Series xiii
Preface to Series xiv
Preface to the Reissue of Integrated Circuit Packaging Materials xv
Preface xvi
Contributors xix
IC PACKAGE RELIABILITY TESTING
MOLD COMPOUND ADHESION AND STRENGTH
MECHANICAL STRESS IN IC PACKAGES
MOISTURE SENSITMTY AND DELAMINATION
THERMAL MANAGEMENT
ELECTRICAL PERFORMANCE OF IC PACKAGES
SOLDERABILITY OF INTEGRATED CIRCUITS
HERMETICITY AND JOINING IN CERAMIC IC PACKAGES
ADVANCED INTERCONNECT TECHNOLOGY
APPENDIX： TECHNIQUE SUMMARIES
