芯片和系统的电源完整性建模与设计（影印版 英文）
作者：（美）斯瓦米纳坦 著
出版时间：2012年版
内容简介
《国外电子信息精品著作（影印版）：芯片和系统的电源完整性建模与设计》包括电源完整性设计和建模两部分内容，重点在建模方面。全书分五章，涵盖了从基础知识到高级应用所需了解的各个细节。书中通过真实的案例分析和可下载的软件实例，描述了当今高效电源分配和噪声最小化的设计与建模的前沿技术，其中很多例子可以进行再仿真实现，这些可以用来评估常用的商用软件的准确性和速度。《国外电子信息精品著作（影印版）：芯片和系统的电源完整性建模与设计》适合研究电源完整性的学生、学者及工程师使用。
目录
Preface
Acknowledgments
About the Autho
Chapter 1
Basic Concepts
1.1 Introduction
1.1.1 Functioning of Traisto
1.1.2 What Are the Problems with PowerDelivery?
1.1.3 Importance of Power Delivery inMicroprocesso and ICs
1.1.4 Power Delivery Network
1.1.5 Traients on the Power Supply
1.2 Simple Relatiohips for Power Delivery
1.2.1 Core Circuits
1.2.2 I/O Circuits
1.2.3 Delay Due to SSN
1.2.4 Timing and Voltage Margin Due to SSN
1.2.5 Relatiohip between Capacitor andCurrent
1.3 Design of PDNs
1.3.1 Target Impedance
1.3.2 Impedance and Noise Voltage
1.4 Components of a PDN
1.4.1 Voltage Regulator
1.4.2 Bypass or Decoupling Capacito
1.4.3 Package and Board Planes
1.4.4 On-Chip Power Distribution
1.4.5 PDN with Components
1.5 Analysis of PDNs
1.5.1 Single-Node Analysis
1.5.2 Distributed Analysis
1.6 Chip-Package Antiresonance: An Example
1.7 High-Frequency Measurements
1.7.1 Measurement of Impedance
1.7.2 Measurement of Self-Impedance
1.7.3 Measurement of Trafer Impedance
1.7.4 Measurement of Impedance by CompletelyEliminating Probe Inductance
1.8 Signal Lines Referenced to Planes
1.8.1 Signal Lines as Tramission Lines
1.8.2 Relatiohip between Tramission-LineParamete and SSN
1.8.3 Relatiohip between SSN and Return PathDiscontinuities
1.9 PDN Modeling Methodology
1.10 Summary
Chapter 2
Modeling of Planes
2.1 Introduction
2.2 Behavior of Planes
2.2.1 Frequency Domain
2.2.2 Time Domain
2.2.3 Two-Dimeional Planes
2.3 Lumped Modeling Using Partial Inductances
2.3.1 Extracting the Inductance and ResistanceMatrices
2.4 Distributed Circuit-Based Approaches
2.4.1 Modeling Using Tramission Lines
2.4.2 Tramission Matrix Method (TMM)
2.4.3 Frequency-Dependent Behavior of Unit-CellElements
2.4.4 Modeling of Gaps in Planes
2.5 Discretization-Based Plane Models
2.5.1 Finite-Difference Method
2.5.2 Finite-Difference Time-Domain Method
2.5.3 Finite-Element Method
2.6 Analytical Methods
2.6.1 Cavity Resonator Method
2.6.2 Network Representation of the CavityResonator Model
2.7 Multiple Plane Pai
2.7.1 Coupling through the Vias
2.7.2 Coupling through the Conducto
2.7.3 Coupling through the Apertures
2.8 Summary
Chapter 3
Simultaneous Switching Noise
3.1 Introduction
3.1.1 Methods for Modeling S SN
3.2 Simple Models
3.2.1 Modeling of Output Buffe
3.3 Modeling of Tramission Lines and Planes
3.3.1 Microstrip Configuration
3.3.2 Stripline Configuration
3.3.3 Conductor-Backed Coplanar WaveguideConfiguration
3.3.4 Summary of Modal DecompositionMethods
3.4 Application of Models in Time-Domain Analysis
3.4.1 Plane Bounce from Return Currents
3.4.2 Microstrip-to-Microstrip ViaTraition
3.4.3 Split Planes
3.5 Application of Models in Frequency-Domain Analysis
3.5.1 Stripline between a Power and a GroundPlane
3.5.2 Microstrip-to-Stripline Via Traition
3.5.3 Reduction of Noise Coupling Using ThinDielectrics
3.6 Exteion of M-FDM to Incorporate Tramission Lines
3.6.1 Analysis of a Complex Board Design
3.7 Summary
Chapter 4
Time-Domain Simulation Methods
4.1 Introduction
4.2 Rational Function Method
4.2.1 Basic Theory
4.2.2 Interpolation Schemes
4.2.3 Properties of Rational Functio
4.2.4 Passivity Enforcement
4.2.5 Integration in a Circuit Solver
4.2.6 Disadvantages
4.3 Signal Flow Graphs
4.3.1 Causality
4.3.2 Trafer-Function Causality
4.3.3 Minimum Phase
4.3.4 Delay Extraction from FrequencyRespoe
4.3.5 Causal SignalFlow Graphs
4.3.6 Computational Aspects in SFG
4.3.7 Fast Convolution Methods
4.3.8 Cosimulation of Signal and Power UsingSFGs
4.4 Modified Nodal Analysis (MNA)
4.4.1 What Is MNA?
4.4.2 Frequency Domain
4.4.3 Time Domain
4.4.4 MNA Formulation with S-Paramete
4.5 Summary
Chapter 5
Applicatio
5.1 Introduction
5.2 High-Speed Serve
5.2.1 Core PDN Noise
5.2.2 I/O PDN Noise
5.2.3 Summary
5.3 High-Speed Differential Signaling
5.3.1 Test Vehicle Description
5.3.2 Plane Modeling
5.3.3 Modeling of Master and Slave Islands
5.3.4 Rational Function Modeling
5.3.5 Modal Decomposition and NoiseSimulation
5.3.6 Summary
5.4 Analysis of IC Packages
5.4.1 Simulation of a Multilayered Package UsingM-FDM
5.4.2 Causal Simulation of HyperBGAPackage
5.4.3 Summary
5.5 Extraction of Dielectric Cotant and Loss Tangent
5.5.1 Problem Definition
5.5.2 Corner-to-Comer Plane-Probing Method
5.5.3 Causal Model Development
5.5.4 Summary
5.6 Embedded Decoupling Capacito
5.6.1 Embedded Individual Thin- or Thick-FilmCapacito
5.6.2 Why Embed Individual Capacito
5.6.3 Design of an Embedded Thick-Film CapacitorArray
5.6.4 Integration of Embedded Capacito into IBMPackage
5.6.5 Embedded Planar Capacito
5.6.6 Summary
5.7 Electromagnetic Bandgap (EBG) Structures
5.7.1 Basic Theory
5.7.2 Respoe of EBG Structures
5.7.3 Dispeion-Diagram Analysis
5.7.4 Modification of M-FDM Using Fringe and GapFields
5.7.5 Scalable Design of EBG Structures forPower Plane Isolation
5.7.6 Digital-RF Integration
5.7.7 ADC Load-Board Design
5.7.8 Issues with EBG Structures for DigitalSystems
5.7.9 Summary
5.8 Future Challenges
Appendix A
A.1 Multiport Networks
A.2 Matrix Representation of Tramission Lines
A.3 Spectrum of Digital Signals
Appendix B Software list
Index
